双(对羟基苯基)甲烷

Description

Bis(p-hydroxyphenyl)methane · CAS 620-92-8 · C13H12O2. UNII QD2C19044Z. Melting Point: 162.5 °C; LogP: log Kow = 2.91; LogP: 2.91.

Identification

CAS Registry Number	620-92-8
PubChem CID	12111
Molecular formula	C13H12O2
IUPAC name	4-[(4-hydroxyphenyl)methyl]phenol
UNII (FDA)	QD2C19044Z

Computed Descriptors

Molecular Weight	200.23
XLogP3	2.9
Hydrogen Bond Donor Count	2
Hydrogen Bond Acceptor Count	2
Rotatable Bond Count	2
Exact Mass	200.083729621
Monoisotopic Mass	200.083729621
Topological Polar Surface Area	40.5
Heavy Atom Count	15
Formal Charge	0

Physical & Chemical Properties

Melting Point	162.5 °C
LogP	log Kow = 2.91
LogP	2.91
Dissociation Constants	pKa1 = 7.55, pKa2 = 10.80 at 25 °C
Collision Cross Section	155.05 Ų [M-H]-

Physical description & handling notes

• Sublimes
• Soluble in ethanol, ether, chloroform, alkali; slightly soluble in DMSO; insoluble in carbon disulfide
• Stable under recommended storage conditions.
• When heated to decomposition it emits acrid smoke and irritating fumes.
• 153.6 Ų [M-H]- [CCS Type: DT; Buffer gas: N2; Ionization: ESI-; Dataset: TOXCAST; Source Identifier: DTXSID9022445]

Regulatory Status

GHS notification summary	3.8% (5 / 130)

GHS Hazard Classification

GHS notification summary	3.8% (5 / 130)
Reported hazard statements	H315 (80.8%), H317 (12.3%), H318 (10.8%), H319 (80.8%), H335 (79.2%), H411 (11.5%), H412 (40%)

Documented Uses

• Bisphenol F is used to make epoxy resins and coatings for various applications, such as lacquers, varnishes, liners, adhesives, plastics, water pipes, dental sealants, and food packaging.
• Epoxy resins based on bisphenol F are used primarily as functional diluents in applications requiring a low viscosity, high performance resin system (e.g., solvent-free coatings). ... Bisphenol F epoxy resins are used in high solids, high build systems such as tank and pipe linings, industrial floors, road and bridge deck toppings, structural adhesives, grouts, coatings, and electrical varnishes.
• The lowest MW member of the phenol novolacs is bisphenol F, which is prepared with a large excess of phenol to formaldehyde; a mixture of o,o', o,p', and p,p' isomers is obtained.
• Non-confidential 2016 Chemical Data Reporting (CDR) information on the production and use of chemicals manufactured or imported into the United States. Chemical: 4,4'-Dihydroxydiphenylmethane:
• Table: National Aggregate Production Volume (pounds) [Table#8074]
• Phenol, 4,4'-methylenebis-: ACTIVE

Synonyms

4,4'-Methylenediphenol; 620-92-8; Bisphenol F; 4,4'-Dihydroxydiphenylmethane; Bis(4-hydroxyphenyl)methane; Phenol, 4,4'-methylenebis-; p-(p-Hydroxybenzyl)phenol; Phenol, 4,4'-methylenedi-; 4,4'-Methylenebisphenol; 4,4'-bisphenol F; BIS(P-HYDROXYPHENYL)METHANE; p,p'-Bis(hydroxyphenyl)methane; 4,4'-Methylene diphenol; 4,4'-Methylenebis(phenol); DTXSID9022445; p,p'-BPF

Frequently Asked Questions

What are the CAS number and molecular formula of Bis(p-hydroxyphenyl)methane?

CAS 620-92-8; molecular formula C13H12O2; molecular weight — g/mol.

What other names is Bis(p-hydroxyphenyl)methane known by?

4,4'-Methylenediphenol, 620-92-8, Bisphenol F, 4,4'-Dihydroxydiphenylmethane, Bis(4-hydroxyphenyl)methane, Phenol, 4,4'-methylenebis-.

Is Bis(p-hydroxyphenyl)methane classified as hazardous?

3.8% of GHS notifications report no hazard classification (5 of 130).

What are the key physical properties of Bis(p-hydroxyphenyl)methane?

Melting Point: 162.5 °C; LogP: log Kow = 2.91; LogP: 2.91; Dissociation Constants: pKa1 = 7.55, pKa2 = 10.80 at 25 °C.

Facts on this page are taken from PubChem (US National Library of Medicine) and Wikidata. Grade-specific data — assay, moisture, particle size, packaging, shelf life — is issued per batch on the COA and is not published here.