Bisphenol A

Description

Bisphenol A · CAS 80-05-7 · C15H16O2. UNII MLT3645I99. Boiling Point: 428 °F at 4 mmHg (NTP, 1992); Boiling Point: 360.5 °C at 760 mm Hg; Boiling Point: BP: 220 °C at 4 mm Hg.

Identification

CAS Registry Number	80-05-7
PubChem CID	6623
Molecular formula	C15H16O2
IUPAC name	4-[2-(4-hydroxyphenyl)propan-2-yl]phenol
UNII (FDA)	MLT3645I99

Computed Descriptors

Molecular Weight	228.29
XLogP3	3.3
Hydrogen Bond Donor Count	2
Hydrogen Bond Acceptor Count	2
Rotatable Bond Count	2
Exact Mass	228.115029749
Monoisotopic Mass	228.115029749
Topological Polar Surface Area	40.5
Heavy Atom Count	17
Formal Charge	0

Physical & Chemical Properties

Boiling Point	428 °F at 4 mmHg (NTP, 1992)
Boiling Point	360.5 °C at 760 mm Hg
Boiling Point	BP: 220 °C at 4 mm Hg
Boiling Point	at 1.7kPa: 250-252 °C
Boiling Point	428 °F
Melting Point	307 to 313 °F (NTP, 1992)
Melting Point	160 °C
Melting Point	156 - 157 °C
Melting Point	150-157 °C
Melting Point	307-313 °F

Physical description & handling notes

• 4,4'-isopropylidenediphenol appears as white to light brown flakes or powder. Has a weak medicine odor. Sinks in water. (USCG, 1999)
• Dry Powder; Other Solid; Large Crystals; CBI; Liquid; Large Crystals; Liquid
• White crystalline solid or flakes with a mild phenolic odour; [CHEMINFO]
• Solid
• WHITE CRYSTALS FLAKES OR POWDER.
• White to light brown flakes or powder with a weak medicinal odor. Reacts violently with acid anhydrides, acid chlorides, strong bases and strong oxidants.

Regulatory Status

Regulatory & Food Contact	FDA Cumulative Estimated Daily Intake (CEDI): FCS FDA Inventory of Food Contact Substances Listed in 21 CFR: FCS
GHS notification summary	0.1% (1 / 2613)

GHS Hazard Classification

GHS notification summary	0.1% (1 / 2613)
Reported hazard statements	H317, H318, H335, H400, H410, H360 (19.4%), H361 (78%), H411 (12.2%)

Documented Uses

• Used as a chemical intermediate, mainly for epoxy resins and polycarbonate resins; [HSDB] Used with epichlorohydrin to produce epoxy resins; [Kanerva, p. 1759]
• Semiconductor Manufacturing [Category: Industry]
• Plastic Composites Manufacturing [Category: Industry]
• Welding Over Coatings [Category: Weld]
• The largest use for bisphenol A is polycarbonate ... followed by epoxy resins. Other uses are flame retardants, unsaturated polyester resins and polyacrylate, polyetherimide, and polysulfone resins.
• ... Used for a wide range of products such as aromatic polyesters with phthalic acid; polysulfones; polyetherketones; unsaturated, hydrolysis-resistant polyesters; antioxidants; phenoxy resins from bisphenol A and epichlorohydrin; and phenolic resins elastified by incorporation of bisphenol A. However, the majority is used for flame retardants, especially tetrabromobisphenol A.

Synonyms

Bisphenol A; 80-05-7; 2,2-Bis(4-hydroxyphenyl)propane; Bisphenol; Diano; 4,4'-Isopropylidenediphenol; 4,4'-(propane-2,2-diyl)diphenol; Diphenylolpropane; 4,4'-Bisphenol A; 2,2-Bis(p-hydroxyphenyl)propane; Parabis A; DIAN; Rikabanol; Bisphenol-A; Biphenol A; Ipognox 88

Frequently Asked Questions

What are the CAS number and molecular formula of Bisphenol A?

CAS 80-05-7; molecular formula C15H16O2; molecular weight — g/mol.

What other names is Bisphenol A known by?

Bisphenol A, 80-05-7, 2,2-Bis(4-hydroxyphenyl)propane, Bisphenol, Diano, 4,4'-Isopropylidenediphenol.

What is the regulatory status of Bisphenol A?

Documented regulatory listings: FDA Cumulative Estimated Daily Intake (CEDI): FCS; FDA Inventory of Food Contact Substances Listed in 21 CFR: FCS.

Is Bisphenol A classified as hazardous?

0.1% of GHS notifications report no hazard classification (1 of 2613).

What are the key physical properties of Bisphenol A?

Boiling Point: 428 °F at 4 mmHg (NTP, 1992); Boiling Point: 360.5 °C at 760 mm Hg; Boiling Point: BP: 220 °C at 4 mm Hg; Boiling Point: at 1.7kPa: 250-252 °C.

Facts on this page are taken from PubChem (US National Library of Medicine) and Wikidata. Grade-specific data — assay, moisture, particle size, packaging, shelf life — is issued per batch on the COA and is not published here.